CIE Components in Electronics
Both companies are looking to employ Micross” engineering expertise, along with its testing and packaging capabilities, to support those OEMs requiring custom adaptations to incorporate Intersil”s precision components into their designs.
“As our bare die and custom packaging partner, Micross will play an instrumental role in growing and supporting the use of Intersil semiconductors in specialty applications,” said Tony Ochoa, Marketing Director, Precision Analog Products at Intersil. “Through this valuable partnership, we continue to increase the availability of our precision analogue ICs in alternative formats to support broader uses.”
Newly available die products will include Intersil”s ultra-precision, low power and/or low noise operational amplifiers; low power instrumentation amplifiers; and low power voltage regulators.
Commenting Tony Hamby, General Manager of US Distribution for Micross said”Like Intersil, many of the customers we support are leaders in their respective fields. By increasing their access to Intersil”s precision products, we”ll be enabling design innovations and enhancing product performance across multiple industries.”
