CIE Components in Electronics
Microsemi Corporation has unveiled a new family of U.S. Defense Logistics Agency (DLA)-qualified Schottky diodes for aerospace and defence applications that require high density power and heat dissipation (typically 0.2-0.85 degrees C per watt (C/W). The new diodes are offered in Microsemi”s patented Thinkey package, which features a rugged ceramic and metal construction with no wire bonds to improve reliability.
The new diodes support high-surge capabilities and enable double-side cooling. Since soft solder is not used in construction of the devices, it prevents solder seal from mixing with mounting solders and eliminates solder creep and re-crystallization during power cycling and high-temperature storage.
“Microsemi has decades of experience designing and delivering high-reliability solutions to the aerospace and defense communities,” said Dr. Simon Wainwright, vice president and general manager of Microsemi”s Hi-Rel group. “Our Thinkey package is one of the many innovations we have developed specifically to meet the stringent requirements of customers in these segments. We will continue to expand our Thinkey Schottky diode product portfolio to include additional DLA-qualified devices.”
