CIE Components in Electronics
The new option will now allow quality control departments a simple and cost-effective method of carrying out 3D failure analysis for more complex geometry electronic assemblies, while at the same time retaining the benefits of 2D inspection. The device is being targeted at companies engaged in electronics assembly, semiconductor manufacture and security-relevant segments such as the automotive industry.
“Flexibility is the keynote of this new CT option,” said Dr Tobias Neubrand, product manager for the phoenix business. “Customers will now have two choices. On the one hand they can have a basic 160 kV microfocus X-ray inspection system to provide cost-effective high magnification and resolution with easy defect recognition in standard electronics inspection tasks. On the other, they can benefit from reinforcing their quality control with 3D inspection capability by adding an easy-to-use CT option. In both versions, the phoenix x|aminer features its own powerful imaging software to allow intuitive programming, while precise component manipulation is achieved using a computer mouse or joystick.”
The high tube power of up to 20 Watt on the target, of the phoenix x|aminer allows a very good sample penetration which is especially needed for high quality CT scans. Equipped with cost-effective image-intensifier-based CT and GE’s easy to use phoenix 3d|arv software for acquisition, reconstruction and visualization of the CT results, the phoenix x|aminer offers both technological and economical benefit
The new system will be of particular interest to the Asian market as it is the first system to be manufactured in China at the company’s ISO-certified, Changzhou manufacturing facility near Shanghai, using core German-made hard- and software components like tubes and generators. This will shorten delivery times to Asian customers, while the rest of the world will continue to be served by GE’s global network of local service and customer care teams.
