CIE Components in Electronics
Both VGAs feature NXP’s smart routing lead design, which simplifies PCB placement and reduces the footprint of the device by 25 percent. NXP will showcase the BGA7204 and BGA7210 at IMS2012, the International Microwave Symposium, in Montréal, Canada, June 19-21.
Designed primarily for use in wireless infrastructure equipment, the new VGAs from NXP ensure that the incoming signal is always at optimum strength by compensating for any degradation caused by changes in temperature. By controlling the power level to the power amplifier, the VGAs also help compensate for variations in cell load and the presence of aging infrastructure equipment.
The BGA7204 and BGA7210 devices come with several power-saving features, including a unique power-save mode that can effectively reduce the current consumption in TDD systems up to 45 percent. The BGA7210 also adds flexible current distribution across its two amplifiers, depending on the attenuation state, to save power.
“These are state-of-the-art, industry-leading VGAs that combine low power consumption with signal support across a very wide frequency band, right up to 4 GHz,” said Kees Schetters, director of marketing, wireless infrastructure, NXP Semiconductors. “By enabling easier signal routing connections, reducing footprint, and supporting platforms with multiple frequency ranges, we’re offering an extremely flexible solution that gives our customers a significant competitive advantage in their infrastructure designs.”
