CIE Components in Electronics
The OV8825 is being positioned as a highly attractive option for smartphone and tablet manufacturers seeking to upgrade their camera designs from the previous generation sensor, the OV8820.
“Industry reports expect tablets to reach 250 million units globally by 2014, with a large portion of those using 8-megapixel cameras. Similarly, industry reports project that smartphones equipped with 8- megapixel cameras will see tremendous growth, with estimates ranging up to more than 500 million units in 2014,” said Vinoo Margasahayam, senior product marketing manager at OmniVision. “Given the low cost and overall performance improvements enabled by our new OmniBSI+ pixel architecture, we feel that the OV8825 is an excellent solution for manufacturers in these booming markets.”
Built on the new OmniBSI+ pixel architecture, the OV8825 offers many improvements including a 60 percent increase in full-well capacity, a 10 percent increase in quantum efficiency and a 10 percent improvement in low-light sensitivity. This means that the OV8825 is able to capture dramatically improved images and video in both bright and low-light conditions.
The 1/3.2-inch, 8-megapixel OV8825 operates at 24 frames per second (FPS) in full resolution, and in full high-definition (HD) video mode at 30 or 60 FPS. The sensor’s high frame rate also helps eliminate image lag for shutter-less designs, and enables continuous shooting, minimized rolling shutter effect and real-time image capture with no lag between resolutions. A high-speed, 4-lane MIPI interface facilitates the required high data transfer rate.
The OV8825’s integrated scaler offers electronic image stabilization, and enables the sensor to maintain full field-of-view (FOV) with improved signal-to-noise performance in 1080p HD video mode at 30 FPS. The sensor’s 2 x 2 binning functionality with a post-binning re-sampling filter function minimizes spatial artifacts and removes image artifacts around edges, delivering clean, crisp color images.
The OV8825 fits into the industry standard module size of 8.5 x 8.5 mm. It is now available for sampling and is expected to enter mass production in the second quarter of 2012.
