CIE Components in Electronics
Distributor Rutronik is now stocking the next generation, ultra low power, compact form factor embedded server platform 5017P-TLN4F from Supermicro which is based on their Mini-ITX motherboard. This server platform delivers 15% more processing performance, up to 50% more 3D graphics performance supporting the latest graphic APIs as well as increased storage I/O performance with SSD caching.
The X9SPV-F/LN4F embedded server platform features Mobile, 3rd generation Intel Core i7/i5/i3 processors and the Mobile Intel QM77 Express Chipset. It offers Dual/Quad core 1.6GHz to 2.7GHz 35W and 25W M Series and 17W U Series processor options and up to 16GB ECC DDR3-1066/1333MHz in dual vertical SO-DIMMs.
1PCI-E 3.0×16 slot (i3 2.0 only), 2 SATA 6Gbs/, 4 SATA 3Gbs/ ports (RAID 0/1/5/10) and a SATA DOM (Disk on Module) power connector are included.
The platform also features VGA Output, Matrox G200eW (default) or Intel Integrated Graphics (DX11) via BIOS setup. It also contains Quad Gb LAN ports (4x82574L), IPMI 2.0 with dedicated LAN and four USB 3.0 ports and six 2.0 ports (four rear and two header).
Combined with Supermicro’s compact short-depth enclosure (SC504-203B) featuring 1×3.5″” or 2×2.5″” SATA2 drive bays, a 200W power supply and PCI express 3.0×16 expansion capability on riser, the rembedded server appliance (5017P-TLN4F) is suitable for applications such as storage head nodes, media transcoding, HD video conferencing, network monitoring, security and firewall management and a variety of other space and power constrained applications.
