CIE Components in Electronics
The Toshiba Corporation and Toshiba Electronics Europe (TEE) have announced that they have begun shipping samples of their 64-gigabyte (GB) embedded NAND flash memory module that is equipped with a Universal Flash Storage (UFS) interface. The first in the industry, the new module is fully compliant with the JEDEC UFS Ver.1.1 standard and is designed for a wide range of digital consumer products – including smartphones and tablet PCs.
The device comes with improved data processing speeds in host chipsets and wider bandwidths for wireless connectivity, demand continues to grow for large density, high-performance memory that supports high-resolution video. A proven innovator in this key area, Toshiba is reinforcing its leadership role by being the first in the industry to ship samples with a 64GB UFS module.
Samples are mainly intended for evaluation of the UFS interface and its protocol in host chipsets and by OS vendors. Toshiba will schedule mass production of the 64GB UFS module, as well as other densities in its line-up, according to market demand.
The JEDEC UFS Ver.1.1 compliant interface handles essential functions, including writing block management, error correction and driver software and it simplifies system development, allowing manufacturers to minimise development costs and speed up time to market for new and upgraded products.
The new products are sealed in a small FBGA 12mm x 16mm x 1.2mm package and have a signal layout compliant with JEDEC UFS Ver.1.1.
