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First Product on New Lattice Nexus FPGA Platform Up to 75% Lower Power Compared to Similar Class Competitive Devices Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today announced the first FPGA developed on its new Lattice Nexus™ FPGA platform, CrossLink-NX™. This new FPGA provides the low power, small …

2.5x smaller than comparable products FiDUS Power, the technical power supply distributor specializing in innovative solutions and new products that benefit system designers as they seek to differentiate their end products, sets a new bar for the size of external power supplies with the launch of the new model GDA200. …

EAO Ltd, Burgess Hill, 15th December 2019 – EAO Ltd has introduced the new Sanyo Denki 9TD12P6G001 70mm Ø x 20mm centrifugal fan with for use in electronic equipment and ventilation systems. Developed by Sanyo Denki, the San Ace 9TD compact centrifugal fan measures just 70mm Ø by 20 mm …

Blaize, formerly known as Thinci, unveils the first true Graph-Native silicon architecture and software platform built to process neural networks and enable AI applications with unprecedented efficiency   News Highlights Blaize Graph Streaming Processorä (GSP) architecture: the first to enable concurrent execution of multiple neural networks and entire workflows on …

Rugged and highly visible when you need strong, robust protection for your enclosure.  Available in blue, orange and red, these protective boots come in 2 styles and 8 sizes making them a perfect fit for many of our handheld enclosures. Held secure in the boot – essential when you need …

What’s New in Electronics Live, the dedicated electronics and manufacturing event, has been successfully acquired by Datateam Business Media and will now join the company’s portfolio of existing events and supporting publications including ‘Electronics’ ‘Electronics World’ and ‘Components in Electronics’ titles. With extensive experience in industry events covering a range …

As a specialist supplier of connectors and cable assemblies for over 30 years, and with particular emphasis on engineering support, Selwyn Electronics has always kept up to date with market trends and new technologies, to ensure that their range of products evolves with these changes. The latest additions are new …

DELO MONOPOX TC2270, a new specialist adhesive ideal for chip bonding – and other applications where electrically insulated heat transfer is required – is now available from Inseto. Inseto, a leading technical distributor of equipment and materials, is now supplying DELO’s new MONOPOX TC2270, a thermally conductive, electrically insulating adhesive, …

When the average consumer thinks of intelligent transportation, they might envision self-driving vehicles dodging obstacles and choosing efficient traffic routes. While that certainly is part of intelligent transportation, there are other critical systems and modules involved that are just as vital but far less recognized. One of the most important …

TySOM embedded systems development platforms and stackable non-volatile memory express FPGA mezzanine cards combination is ideal for applications requiring high-bandwidth, low-latency access to SSDs within a reprogrammable system architecture. Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, has launched a powerful, …