Internet of Things

 Silicon Labs, a specialist in secure, intelligent wireless technology, has announced the new xG22E family of Wireless SoCs, Silicon Labs’ first-ever family designed to operate within the ultra-low power envelope required for battery-free, energy harvesting applications. The new family consists of the BG22E, MG22E, and FG22E. As Silicon Labs’ most …

CUI Inc, a Bel group company, has announced two new chassis mount DC-to-DC converters for consumer, industrial and IoT applications. The converters are available in two options: the PST50W series with a 50 W power isolated output and the PST75W series with a 75 W power isolated output. Both DC-to-DC …

Farnell says that is has substantially expanded its already extensive range of passive component stock with the addition of new arrivals from brand names such as YAGEO, Kemet, Murata, Wurth Electronik and Panasonic. The passive component market is expected to continue expanding in the coming years. The rising popularity of …

NeoCortec, the specialists on wireless connectivity and providers of ultra-low-power bi-directional wireless mesh network hardware and software solutions, are showcasing a new demo on their stand (Hall 3 Stand 526) and in two of the exhibition halls at Embedded World in Nuremburg. This demonstration illustrates the seamless and rapid development …

Murata has unveiled its Type 2GT module, a multi-band, low-power radio (LoRa) module which it says “marks a significant leap forward in the development of IoT devices requiring versatile wireless connectivity”. This highly integrated module stands out by offering a comprehensive solution that caters to the complex demands of global …

SECO is working with NXP Semiconductors to bring SECO’s Clea software solution to industrial and IoT applications. Clea is the full-fledged AI as a Service (AIaaS) Platform and optimization of Clea on NXP hardware will facilitate the deployment of AI models for device manufacturers across industrial and IoT applications. SECO, …

Advantech, a provider of AIoT platforms and services, are participating at Embedded World 2024, a trade show taking place in Nuremberg April 9-11, 2024. Visitors will find Advantech’s 160 m2 booth in Hall 3, Booth 339, where the company’s comprehensive portfolio based on different hardware architectures (x86/ARM) and dedicated software services …

As the world comes to rely on interconnected IoT systems—for everything from household items like smart thermostats, virtual assistant technology and digital door locks to medical and industrial applications—the need for reliable cybersecurity on embedded systems has never been greater. To increase security on IoT products and facilitate easier setup …

IBASE Technology, a provider in the design and manufacturing of embedded computing solutions, will collaborate with Qualcomm Technologies to showcase next-generation edge AI solutions at the upcoming Embedded World 2024 (April 9-11, 2024). IBASE is on booth 3-351 in hall 3 where you can see solutions for your IoT devices. …

AI and semiconductor expert XMOS has announced its partnership with embedded audio software specialist DSP Concepts. The agreement will allow audio professionals to combine XMOS’ highly-deterministic, low latency xcore.ai platform with DSP Concepts’ Audio Weaver software, which enables users to graphically design and debug audio and voice solutions utilising multicores easily from …