Toshiba Electronics Europe has launched two new automotive-grade 40V N-channel power MOSFETs that will have real impact on next-generation vehicle designs. The XPQR3004PB and XPQ1R004PB utilise the game-changing large transistor outline gull-wing leads package format – referred to as L-TOGL. Thanks to their L-TOGL packages, and the enhanced heat dissipation …
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Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has announced a new gate driver IC that is designed to drive high-voltage power devices such as IGBTs (Insulated Gate Bipolar Transistors) and SiC (Silicon Carbide) MOSFETs for electric vehicle (EV) inverters. Gate driver ICs are essential components to EV inverters, …
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Rutronik Elektronische Bauelemente GmbH again takes part at embedded world 2023 (March 14 – 16, 2023) this year. In hall 2 at booth 248 the experts of the broadline distributor show innovative products of leading manufacturers and complete system solutions. The focus is on components from the areas of displays, …
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RF and mmWave specialist Filtronic has further enhanced its hybrid and semiconductor packaging capabilities by investing in a fully automated wedge bonder suitable for power semiconductors, automotive power modules, and industrial power hybrids. The state-of-the-art auto-wedge bonder improves capacity and adds volume process capabilities that will enable the company to explore …
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The AX01 and MA01 series of floating board-to-board connectors from Japan Aviation Electronics Industry (JAE) combine a high transmission speed (8 Gbps+) with floating contacts to minimize mating-centering errors. For the ADAS market, which is growing rapidly due to new regulations and legislation, JAE’s AX01 and MA01 connectors provide highly …
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Renesas Electronics, a supplier of advanced semiconductor solutions, has launched a new automotive Intelligent Power Device (IPD) that will safely and flexibly control power distribution within vehicles, addressing the requirements of next-generation E/E (electrical/electronic) architectures. The new RAJ2810024H12HPD is available in the small TO-252-7 package and reduces the mounting area …
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Rohde & Schwarz’s Demystifying EMC (DEMC) virtual conference will take place from 7 to 8 February 2023 in Europe and 8 to 9 February in Asia Pacific and the Americas, followed by a series of in-person events around the world. Through conference presentations, workshops and live panel discussions, participants will …
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Cadence Design Systems has announced, what it describes as, the first LPDDR5X memory interface IP design optimized to operate at 8533Mbps—up to 33 per cent faster than the previous generation of LPDDR IP. Available now for customer engagements, the Cadence LPDDR5X IP features a new high-performance, scalable and adaptable architecture …
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Real-Time Innovations (RTI), the software framework company for autonomous systems, has partnered with Ansys, a leader in simulation software. This collaboration accelerates the development, testing and deployment of high-performance and high-reliability distributed systems by allowing them to be simulated without their underlying hardware, which may have limited availability or be …
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Ambarella, an edge AI semiconductor company, and Applied Intuition, a software solutions provider for autonomous vehicle (AV) development, have announced a partnership to offer a joint ADAS and AV development solution based on Ambarella’s CV3-AD PCIe hardware-in-the-loop (HIL) card and Applied’s simulation software. Testing with real electronic control units (ECUs) …
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CIE Components in Electronics