Analog Devices, Inc. today announced a transceiver series that enables high-definition (HD) video over existing Unshielded Twisted Pair cables and unshielded connectors. This allows OEMs to upgrade easily from standard-definition cameras to HD cameras and provide the superior resolution and image quality required for today’s automotive camera applications. The new …
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PEM self-clinching SH nuts and HFLH studs from PennEngineering can successfully install in high-strength thin steel sheets to provide permanent threads for mating hardware in automotive component attachment applications. These hard panel nuts and studs manufactured from hardened alloy steel ultimately exhibit stronger thread strength compared with conventional fasteners. The …
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Cypress Semiconductor Corp., the embedded solutions leader, has announced that global automotive supplier Yazaki North America has implemented Cypress’ instrument cluster solution to drive the advanced graphics in its instrument cluster for a leading American car manufacturer. Yazaki selected Cypress based on its unique offering of five chips that combine …
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Schaffner, the international leader in the field of electromagnetic compatibility and power quality will be presenting products and services from their EMC and Automotive Divisions at electronica 2018. EMC filters specifically designed for medical devices offer end users simple solutions to EMC issues and get product certifications without adding any …
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Toshiba Electronics Europe has announced a new Bluetooth IC for automotive applications will be added to their IC line-up. The TC35681IFTG is based on an arm Cortex-M0 CPU and is compliant with Bluetooth Low Energy (LE) core specification 5.0. It will be used in various automotive applications including Remote Keyless Entry (RKE), On-Board Diagnostics …
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Newbury Innovation has taken its support of the electronics students at Bath University to a new level by agreeing to become a Gold level sponsor for this year’s Team Bath Racing Electric (TBRe) team. The agreement gives the student engineering team access to all the PCBs that they may require …
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UltraSoC and ResilTech has announced a collaboration that brings together their expertise and technologies to further the functional safety compliance of automotive systems, focusing particularly on the ISO26262 standard. UltraSoC’s embedded analytics technology provides a powerful platform for developers who need to verify and validate the security and functional safety of their products, …
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Fujitsu Electronics Europe (FEEU) introduces the newly developed automotive FRAM device MB85RS64VY which is optimised for usage in the automotive sector. This is the third product of FEEU’s new automotive FRAM family, following the release of two models with 256Kbit and 128Kbit in 2017. It features a temperature range up to 125°C …
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Infineon Technologies AG and XAIN have agreed to work together on bringing blockchain technology into the car. The Munich semiconductor maker and the Berlin-based start-up have signed a corresponding Memorandum of Understanding at Infineon’s 1st Automotive Cybersecurity Forum, that took place yesterday in Munich. The goal of the collaboration is …
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Infineon Technologies AG is enabling a crucial step toward greater cybersecurity in the connected car. The Munich-based company is the world’s first semiconductor manufacturer to put a Trusted Platform Module (TPM) specifically for automotive applications on the market. The new OPTIGA TPM 2.0 protects communication between the car manufacturer and …
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CIE Components in Electronics