Melexis has revealed new LIN BLDC-motor pre-drivers that combine small size with high performance and power capability for automotive mechatronic applications. The MLX81340 (32KB Flash) and MLX81344 (64KB Flash) integrate three channels of high-side and low-side drivers. They control external NFETs with up to 60nC capacitance to handle applications up …
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TouchNetix, a manufacturer of high-performance touchscreen controller ICs, has announced that its aXiom AX112 user interface chip has gained qualification to the Automotive Electronics Council’s AEC-Q100-6 standard, validating the device’s use in applications such as the central information display in passenger cars and other types of vehicles. The aXiom AX112, …
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CoreAVI is to provide graphics and compute driver support for NXP Semiconductors’ Arm Cortex-A53-based i.MX 8 applications processors with dual GPUs to enable next generation low powered, scalable performance capabilities for functionally safe automotive platforms. CoreAVI’s Vulkan SC-based graphics and compute driver VkCore SC, as well as its OpenGL SC …
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Renesas Electronics, a supplier of advanced semiconductor solutions, has introduced a new family of multi-cell full battery front end (BFE) ICs for battery management systems (BMS) built for the larger, high-voltage battery packs that power e-scooters, energy storage, high-voltage power tools, and other high-voltage equipment. The new ICs provide fast, …
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NXP Semiconductors has announced the new BTS6302U/6201U pre-drivers and BTS7203/5 dual-channel receive (RX) front end modules (FEM) for 5G massive multi-input multi-output (MIMO) infrastructure. These new devices offer low current consumption, reducing carrier operating costs. Developed using NXP’s silicon germanium (SiGe) process and in-house test and assembly, the new devices …
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From 30th November to 2nd December 2021, Analog Devices (ADI) will participate in Enlit Europe, in Milan, Italy. Enlit Europe is the new identity that combines the former European Utility Week and POWERGEN Europe. On stand 12.D110, ADI will showcase its comprehensive portfolio enabling digital energy infrastructure solutions for EV …
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Delivering on its promise to tackle the cost and complexity of automotive software development, NXP has released its Real-Time Drivers (RTD) software supporting all S32 automotive processors featuring Arm Cortex-M or Cortex-R52 cores. One of several new offerings in the S32 software enablement platform, RTD supports the new S32K3 and …
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Sivers Semiconductors has entered into an agreement to acquire 100 per cent of the share capital of MixComm, a US-based mmWave challenger fabless semiconductor company, for an initial purchase price of USD 135m on a debt-free basis. Following completion, the enlarged Sivers group will be a global leader in 5G …
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Inseto, a technical distributor of equipment and materials, has invested in a Kulicke & Soffa (K&S) Asterion wedge bonder. Located in Inseto’s Process Development Laboratory along with materials test and plasma cleaning equipment, the automatic bonder is suitable for the large-wire, fine-wire and ribbon bonding of hybrid circuits, semiconductor devices, …
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Extended-temperature-range voltage reference ICs for automotive and industrial applications require low drift, high reliability and high performance. Microchip Technology has released a high-precision voltage reference (Vref) IC that meets these needs at a cost-effective price. The new MCP1502 is an AEC-Q100 Grade 1 (-40°C to +125°C operating temperature range) automotive-qualified …
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CIE Components in Electronics