ICs & Semiconductors

Microsemi Corporation has unveiled the new ZL30169 high performance Optical Transport Network (OTN) clock translator. Fully compliant with the ITU-T G.8251 standard it ensures interoperability and satisfactory network performance. The ultrasmall, three-input, three-output any-rate-to-any-port clock translator for OTN provides output clocks with industry-leading jitter performance of 250fs RMS, ideal for 100G coherent optical networks.

Integrated Device Technology (IDT) has announced the development of a compute architecture that is intended to handle the immense data demands of online gaming, high-performance computing and analytics through high-density, low-latency clusters of connected mobile processors. In conjunction with Orange Silicon Valley, IDT has co-developed a massive highly scalable, low-latency cluster of low-power NVIDIA Tegra K1 mobile processors, using the company’s RapidIO interconnect technology to connect multiple nodes at up to 16 Gbps.

Toshiba Electronics Europe (TEE) has launched the industry's first VESA’s embedded Display Port (eDPTM)-to-MIPI dual-DSI converter chipset. The new TC358860XBG chipset enables 4K2K ultra high definition (UHD) experiences on handheld electronic devices such as tablets, phablets and portable gaming systems.

Cypress Semiconductor has announced its radiation-hardened (RadHard) 72-Mbit Quad Data Rate II+ (QDR-II+) SRAMs and 4-Mbit fast asynchronous SRAMs have achieved Qualified Manufacturers List Class V and Class Q requirements - the highest standards of quality and reliability for aerospace-grade ICs.

The FT600Q and FT601Q are FTDI Chip’s first generation USB 3.0 products that function as SuperSpeed USB 3.0 to FIFO bridges, providing data bursting rates of up to 3.2Gbps. The FT600Q comes in 56-pin QFN package and has a 16-bit wide FIFO bus interface, while FT601Q comes in 76-pin QFN package and has a 32-bit wide FIFO bus interface. Both chips support up to 8 endpoints, other than the management endpoints. The endpoints are linked to a configurable endpoint buffers of 16kByte length for IN and 16kByte for OUT.

Toshiba Electronics Europe has expanded its line-up of image recognition processors with the launch of the TMPV760 series. Supported by 14 hardware-based image recognition accelerators, the first device in this new series will support the implementation of next generation Advanced Driver Assistance Systems (ADASs). The TMPV7608XBG supports standard ADAS features such as AEB (Autonomous Emergency Braking), TSR (Traffic Sign Recognition), LDW (Lane Departure Warning) / LKA (Lane Keeping Assist), HBA (High Beam Assistance), FCW (Forward Collision Warning).

Murata has introduced the SCC2000 series of combined accelerometer and gyroscope sensor devices aimed at use in tough environments such as those encountered in automotive and industrial applications. The series has best in class temperature dependency, shock sensitivity and bias stability characteristics and consists of a low-g 3-axis accelerometer with two angular rate sensor options of either X or Z-axis detection, together with a 32-bit digital SPI interface.

ams AG has released a new family of intelligent sensors that integrate six key sensing functions including gesture detection and Mobeam barcode emulation. The TMG399x product family is suited for touchless gesture control and display management in smartphones, tablets and many other consumer electronics on the market today.

STMicroelectronics has introduced a new generation of processors for Car-Radio and Display-Audio applications. Building on the success of the popular STA1052 audio System-on-Chip, the new Accordo2 family (STA1095 and variations) offers an unprecedented level of hardware and software integration, thereby enabling the industry’s fastest time-to-market solutions at the greatest value.

Renesas Electronics Europe is making available the “Connect it! - TPS-1 Solution Kit”, a complete evaluation tool for the TPS-1PROFINET isochronous real time (IRT) device chip. The new kit includes all the hardware, software and demonstration programs customers need to start their own developments on a PROFINET network.The kit has been developed to facilitate integration for customers developing solutions for Europe’s dominant industrial Ethernet market and helps them get their products to market faster.