CISSOID, a leading supplier of high-temperature and high reliability semiconductor solutions, has unveiled a new version of HADES, its turnkey isolated gate driver reference design, which has been tailored to support SEMISOUTH silicon carbide (SiC), normally-off power JFETs (SJEP120R100).
Read More »ST integrates RealVNC’s remote control technology to enable smartphone-centric in-vehicle infotainment
STMicroelectronics has integrated remote control technology from RealVNC, the original inventor and provider of VNC, onto its automotive-grade infotainment application processors. The integration will help to simplify and speed up the roll out of mobile-to-vehicle connectivity solutions, supporting the seamless and safe interplay of phones, apps and cars.
Read More »Melexis bring LIN-ready single chip solution to BLDC motors & actuators
Melexis has launched its next generation IC family for sensor-less and sensor based BLDC motor control in automotive applications. The new IC family consists of 4 base members; the MLX81205, MLX81207, MLX81210 and MLX81215. Each is available with a variety of memory configurations and in different package options.
Read More »MEMS microphones set to provide the foundation for voice-enabled homes
STMicroelectronics is set to play a leading role in the European research project on ‘Distant Speech Interaction for Robust Home Applications’ (DIRHA). The three-year program aims to investigate and prototype solutions for natural voice-enabled interaction between humans and machines in tomorrow’s smart homes.
Read More »New low-power accelerometer senses shocks up to 400g in 3D
STMicroelectronics has unveiled a motion sensor that measures very high accelerations along all three axes at ultra-low current consumption. The H3LIS331DL accelerometers address the need for precise shock detection up to 400 g in space- and power-constrained applications, from car black boxes to medical monitoring devices and sports equipment.
Read More »Wolfson introduces next generation HD Audio System-on-a-Chip (SoC)
Wolfson Microelectronics has announced its next generation High Definition (HD) Audio System-on-a-Chip (SoC) with voice processor DSP, designed to smartphone manufacturers deliver clearer, more natural sounding voice calls in loud and noisy environments.
Read More »Maxim’s secure EEPROM technology safeguards FPGA IP with a single pin
With device manufacturers losing billions of dollars per year to “grey market” piracy Maxim Integrated Products has unveiled a reference design that will protect Xilinx Spartan-6 field-programmable gate arrays (FPGAs). The reference design comprises free security software from Maxim or Xilinx and the Maxim DS28E01-100, a 1-Wire secure memory device.
Read More »TI introduces integrated audio codec for mobile devices
Texas Instruments has introduced what it says is the industry’s most highly integrated audio codec with embedded miniDSP cores, providing echo and noise cancellation at wideband voice sampling rates up to 16 kHz. The TLV320AIC3262 integrates five amplifiers and two miniDSP cores, and gives designers the ability to interface with to up to three devices simultaneously, such as application, Bluetooth and baseband processors.
Read More »32 QFN package for Lattice’s MachXO2 programmable logic devices
Lattice Semiconductor has announced the immediate availability of its low cost, low power MachXO2 family of programmable logic devices (PLD) in a new 32 QFN (Quad Flatpack No-leads) package. Launched in 2011 the addition of this small 5mm x 5mm form factor package option extends the use of the MachXO2 PLDs to applications where size constraints, ease of layout and manufacturability are critical.
Read More »Intrinsic-ID offers secure boot feature on new VoIP processor from Dialog Semionductor
Dialog Semiconductor"s SC14453S has become the world’s first commercially available Voice over IP (VoIP) processor circuit that integrates Intrinsic-ID’s patented Hardware Intrinsic Security IP – also referred to as Physical Unclonable Function (PUF).
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