Features

Avnet Memec has announced that it has been appointed as European distributor for Quectel, a specialist in M2M wireless modules. Quectel is expanding its sales channel network in Europe to drive growth of its M2M and Internet of Things business in the region.

Toshiba Electronics Europe has started sample shipments of 32-gigabyte and 64-gigabyte (GB) embedded NAND flash memory modules compliant with the JEDEC UFS Ver.2.0 standard, the first company in the industry to do so. The product supports maximum transfer rates up to 11.6Gbps by integrating two 5.8Gbps High-speed MIPI M-PHY] HS-G3 I/F data lanes - an optional feature of UFS Ver. 2.0.

Microchip has unveiled a new parallel Flash memory device—the SST38VF6401B. The device is a 4M x16 CMOS Advanced Multi-Purpose Flash Plus (Advanced MPF+) device manufactured with Microchip’s, high-performance CMOS SuperFlash technology, a split-gate cell design and thick-oxide tunnelling injector for better reliability and manufacturability. This device conforms to JEDEC standard pin assignments for x16 memories.

STMicroelectronics has expanded its 8-bit automotive-grade microcontroller portfolio. It has added competitively priced new devices in compact packages, featuring 20 MIPS processing performance and a peripheral set optimized for automotive body electronics and comfort applications.

ON Semiconductor has announced the availability of new qualified intellectual property (IP) on its proprietary ONC18 180 nanometer (nm) process technology. The newly qualified circuit blocks will help ON Semiconductor’s foundry (GDS2) interface customers minimise the risk of the need for silicon re-spins and therefore help reduce development costs and shorten time-to-market for new designs.

Texas Instruments (TI) has introduced six new AEC-Q100-qualified gate drivers with what it says are the industry’s fastest propagation delays of less than 15 nanoseconds. According to TI the new UCC275xx-Q1 family of single- and dual-channel gate drivers will provide improved power efficiency, reliability and flexibility compared to existing solutions for automotive applications.

Avnet Abacus is now stocking hundreds of standard connector application tooling products from Molex and TE Connectivity (TE), and can offer a minimum order quantity (MOQ) of one piece on all application tooling from both manufacturers with lead times of typically less than two weeks.

Artesyn Embedded Technologies, formerly Emerson Network Power’s Embedded Computing & Power business, has introduced two new families of high performance isolated dc-dc converters for radio-frequency (RF) power amplifiers, used in micro and macro cell, NodeB/eNodeB, and remote radio head (RRH) applications. The first, the AVE family, is a half-brick format offering higher than 94 percent typical efficiency and impressive levels of thermal performance, making it suitable for small space and high power applications.

BEC Distribution, ARCOL's UK Distributor has announced the availability of ARCOL's AP101 and AP140 non-inductive resistors which feature extremely low thermal resistance. They AP101 is capable of dissipating 100 watts and the AP140 can dissipate up to 140 watts, with a maximum current rating of 25A.

B&B Electronics’ iMediaChassis family of multiport chassis offers operators, ISPs, and data centre users a low cost and extremely compact, 3U high, one box solution, for CWDM services. In addition to the physical conversion of either local fibre or copper to specific CWDM wavelengths, the product also offers advanced management features allowing the operator to monitor a wide variety of parameters, most importantly quality of the optical signal.