Dialog Semiconductor, a provider of integrated power management, audio, AC/DC and short-range wireless technologies, has announced that it has licenced Tensilica HiFi Audio/Voice DSP IP from Cadence Design Systems. Dialog will initially deploy the IP to develop next-generation audio solutions for its connectivity products.
Read More »Outdoor version of Han-Yellock industrial connector released
Harting has introduced a new outdoor version of its Han-Yellock industrial connector system featuring specially selected materials and a surface structure designed to withstand salt mist and industrial exhaust gases as well as ultraviolet radiation.
Read More »New series of low input current optocouplers from Vishay available from TTI
A new series of low input current optocouplers with phototransistor output from Vishay can now be ordered from TTI. The VOS627A and VOS628A series optocouplers broaden Vishay"s optoelectronics portfolio and feature the compact SSOP-4 mini-flat package and the flexibility to choose from variable transfer ratio (CTR) ranges.
Read More »Digi-Key signs low-power Wi-Fi manufacturer GainSpan
Digi-Key Corporation has signed a global distribution agreement with GainSpan, a leading supplier in the low-power 802.11 Wi-Fi market. GainSpan is a leading semiconductor solutions company in low-power Wi-Fi and Wi-Fi connectivity for the Internet of Things.
Read More »Samsung starts mass production of advanced DDR4 using latest process technology
Samsung Electronics is mass producing the most advanced DDR4 memory, these high-performance, high-density DDR4 modules can better support the need for advanced DDR4 in rapidly expanding, large-scale data centers and other enterprise server applications.
Read More »Toshiba introduces larger capacity USB 3.0 flash drives
Toshiba Electronics Europe has launched an updated range of Super Speed USB 3.0 flash memory USB drives. The TransMemory-EX IITM drives feature increased read and write speeds and are available with capacities of 32GB, 64GB and 128GB.
Read More »Osram’s new MultiLED provide more options for automobile designers
Rutronik is stocking Osram Opto Semiconductors’ new multi-chip-LEDs. With a broad bright blue colour range lighting designers now have a free choice of colours for the interior lighting in vehicles. Colour design now covers cluster lighting to an increasing extent, notably in combined instruments such as speedometers and rev counters, in displays, as backlighting for switches and for ambient lighting.
Read More »FTDI Chip launches development modules for intelligent display systems
FTDI Chip has released the VM800C – a family of credit card sized (85.6mm x 54.1mm) development module, and the VM800B – an encased version of this module in a fitted, plastic bezel. The portfolio is comprised of 11 specific part types in total, all based on the company’s Embedded Video Engine (EVE) platform - which provides display, audio and touch capabilities on a single chip.
Read More »Ginsbury to supply Ocular PCAP touch screens
Display specialist, Ginsbury has announced a new distribution agreement with Ocular, the US touch screen manufacturer. The agreement will see Ginsbury promote and market Ocular"s Crystal Touch: TRUE Multi-Touch projected capacitive (PCAP) touch screens in the UK and Ireland.
Read More »TE Connectivity’s Power Triple Lock wire-applied connector system now available from TTI
TE Connectivity’s new Power Triple Lock wire-applied connector system has been designed to improve reliability among a broad range of power and signal applications and can now be sourced through TTI. The design assures connector performance with three locking capabilities including terminal position assurance, integrated latching mechanism and connector position assurance.
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