Wireless & Communications

B&B Electronics, a developer of rugged wireless and wired M2M connectivity solutions for harsh environments, has expanded its family of industrial-grade USB port protectors with the small-form-factor, affordable USBSSP2 “USB Sentinel” USB 3.0 surge suppressor.

Link Microtek, a UK based manufacturer of infra-red, RF and microwave systems, has won a 4-year contract from the UK MoD for the provision of spares, repairs and other support services for the company’s Azdec mobile infra-red communications system. Installed on board various ships within the Royal Navy fleet, the Azdec system provides secure, wire-free, short-range voice communications, giving personnel the freedom to roam unhindered from their base positions.

Semtech Corporation, a supplier of analogue and mixed-signal semiconductors, has introduced the SX1272 the first product in a new long-range RFIC platform designed to bost the transmission range of the devices to up to 15 kilometers (km). This device integrates Semtech’s new LoRa (long range) modulation technology to enable drastic range improvements over alternative modulation methods.

Murata has launched the LBEP series of wireless modules providing wireless LAN, Bluetooth and Bluetooth low energy (BLE) connectivity. These devices are based around the WiLink 8.0 solutions from Texas Instruments (TI), and the miniature modules measure just 8.8 x 9.9 x 1.3 mm and offer a low cost, integrated approach to providing wireless connectivity to a wide range of consumer, industrial and commercial applications.

In response to growing demand for faster wireless broadband connections STMicroelectronics is looking to address the demand for more complex circuitry by developing an advanced component process technology that is specifically optimised to increase performance and reduce the size of the RF (radio frequency) front-end of mobile devices.

Anritsu Corporation has received the world"s first PTCRB approval for its ME7873L RF Conformance Test System meeting the LTE Rel-10 Carrier Aggregation Standard. The new 4G mobile LTE-Advanced standard supports the carrier aggregation function offering faster communication speeds than the LTE technology now being deployed worldwide.

At this year"s VLSI circuits Symposium in Kyoto (Japan), imec and Renesas Electronics Corporation have unveiled the world’s first multi-standard radio frequency (RF) receiver in 28nm CMOS technology, and a 28nm analogue-to-digital converter (ADC) targeting wide-bandwidth standards such as LTE-advanced and next-generation WiFi.

Nujira Ltd, considered the market leader in Envelope Tracking (ET) technology, has unveiled its newest Coolteq.L ET power supply modulator chip for LTE handsets. According to Nujira the NCT-L1300 is able to deliver the best ET modulator performance on the market across all key metrics: system efficiency, noise, bandwidth, linearity and RF output power. The new chip is now being geared up for volume production to support 4G smartphone shipments in 2014.

Microsemi has expanded its Synchronous Ethernet (SyncE) product portfolio with a single-chip, ZL30162 timing card device designed for mobile infrastructure and packet-based carrier Ethernet networks. The ZL30162 features four T0 high quality and highly programmable integrated digital phase lock loops (DPLLs), capable of locking up to 11 inputs for applications that require independent transmit and receive timing paths.

AVX Corporation has launched a new low-profile 0603 diplexer at the International Microwave Symposium in Seattle, Washington. Based on the company’s patented multilayer organic high density interconnect technology, the new 0603 MLO diplexer employs high dielectric constant and low loss materials to realise high Q passive printed elements, such as inductors and capacitors in a multilayer stack up.