The new R&S RT-ZVC multichannel power probe, in combination with an R&S CMW radio communication tester, monitors the power consumption of chipsets, radio modules and mobile devices. It is the ...
Read More »Allegro MicroSystems Europe announces news 0° to 360° angle sensor ICs
Allegro MicroSystems Europe has introduced two new 0° to 360° angle sensor ICs that provide contactless high-resolution angular position information based on magnetic Circular Vertical Hall (CVH) ...
Read More »First raft of speakers confirmed for The Engineer Conference
The first raft of speakers has been confirmed for The Engineer Conference, the high-end, free educational programme that runs during Subcon, the Advanced Manufacturing Show and The Engineer Design &...
Read More »Samtec connector range from RS Components targets wireless telecommunications
RS Components (RS), the trading brand of Electrocomponents plc, the global distributor for engineers, has announced that it is expanding its Samtec product range with the introduction of more than ...
Read More »Digi-Key helps fuel innovation at embedded world 2017
During Embedded World 2017 in Nuremburg, Germany, Digi-Key Electronics, a global electronic components distributor, will have representatives on-hand at booth A4-631 to talk about how their breadth ...
Read More »Unique test solution from Rohde & Schwarz analyses IP security mechanisms in IoT and mobile devices
Adding the R&S CMW-KM052 analysis option makes the R&S CMW500 wideband radio communication tester a valuable tool for improving the security of IP-based data communications for mobile devices ...
Read More »Strategy TRANSFORM 2025+: Volkswagen launches programme for key future technologies
Volkswagen secures its position in the field of future vehicle innovations. The company's first partner here is Infineon Technologies, one of the world's leading semiconductor suppliers. Volkswagen ...
Read More »APEC 2017 brings in new products from Knowles Capacitors
APEC 2017 will see Knowles Capacitors exhibiting a range of new and updated products from its Syfer, Novacap and DLI brands. Visitors to booth 739 will have the chance to see range extensions in AEC-...
Read More »BVM creates new business development manager position as growth ramps up
Southampton, UK based BVM Limited has appointed Dave Ripley, who comes with a wealth of BDM experience in the embedded computing sector. Working with both end users and distribution channel partners, ...
Read More »Rohde & Schwarz and MediaTek announce collaboration on test concepts for 5G wireless communication technologies
Rohde & Schwarz and MediaTek have signed a Memorandum of Understanding (MoU) to cooperate on developing test solutions for 5G. A first joint 5G technology proof-of-concept trial for 28 GHz beam ...
Read More »