CIE Components in Electronics
SECO, a global specialist in delivering end-to-end technological solutions for industrial digitalization, will showcase a diverse array of solutions and technologies poised to enable a new generation of digital devices in the upcoming embedded world Exhibition & Conference in Nuremberg. At booth 1-320 visitors can discover SECO’s comprehensive and modular offering, from high-tech edge computing platforms to the edge and cloud IoT software suite, Clea, to the AI-power support system, StudioX, tailored to maximize the potential of their products and fully leverage new technological opportunities.
Computer on Modules
At the booth, visitors can discover SECO’s latest Computer-on-Module solutions, featuring next-generation processor technologies across x86 and Arm architectures. The COM Express Basic SOM-COMe-BT6-MTL and the COM-HPC Client SOM-COM-HPC-A-MTL both feature Intel Core Ultra Processors (Codename: Meteor Lake) and are tailored for AI and IoT end devices. The SOM-SMARC-MX95 packs the NXP i.MX 95 application processors in a compact, SMARC -compatible module to impressive processing power and advanced security features for the next wave of edge applications. The SOM-SMARC-QCS6490 streamlines access to Qualcomm QCS6490 SoC, offering support for computing intensive and on-device machine learning applications. The SOM-SMARC-Genio 700, featuring the MediaTek Genio 700 application processor, is a powerful yet energy-efficient solution enhanced for demanding industrial IoT applications. Boasting vast expertise in COM design and manufacturing, SECO will unveil its latest addition to the COM Express portfolio, based on Intel next gen Atom processors, underscoring its commitment to staying at the forefront of technological innovation.
Fanless embedded computers
Attendees can also explore SECO’s range of fanless embedded computers engineered for seamless system integration in IIoT use cases. Highlights include the Palladio 500 RPL, a fanless embedded PC powered by the 13th Gen Intel Core processors (Codename: Raptor Lake), featuring impressive modularity and expandability. The Modular Link MX93 is a cost-effective industrial PC featuring NXP i.MX93 application processor engineered for intelligence at the edge, offering simplified integration and unparalleled versatility. The Titan 300 TGL-UP3 AI is an edge-AI ready solution that integrates the processing performance of the 11th Gen Intel Core and Celeron SoCs with a single Axelera AI’s Metis AIPU capable of delivering up to 120 TOPS.
Modular vision HMIs
An integral component of SECO’s exhibition will be the scalable Modular Vision HMI family, featuring off-the-shelf solutions based on x86 and Arm architectures, with screen sizes ranging from 7 to 15 inches and up to 4K resolution. This versatile platform facilitates application-specific customizations, enabling users to tailor processor performance to meet evolving demands seamlessly.
IoT & AI
All SECO hardware products are born natively integrated with Clea, SECO’s open source, modular software suite that simplifies IoT implementations by harnessing field data for actionable insights. Clea facilitates real-time infrastructure management, analytics, predictive maintenance, secure remote software updates, and deployment of intelligent apps and value-added revenue-generating subscription services. Building upon generative AI, SECO introduces StudioX, a solution for businesses to enhance operational efficiency, improve customer satisfaction, and deploy novel revenue-generating services via their own AI-powered support services.
The SECO booth will feature a number of specific application demos with Clea and StudioX in action, to highlight the power and ease of data orchestration and AI across diverse use cases.
Visitors are invited to experience the SECO solutions and meet experts in person in Hall 1, booth 320, at the Exhibition Centre in Nuremberg, Germany, from 9 to 11 April 2024.
