CIE Components in Electronics
Molex Incorporated has introduced the SpeedStack Mezzanine Connector System, a high-density, low-profile solution that supports data rates of up to 40 Gbps per differential pair. The system is suitable for OEMs that contend with limited PCB real estate in a variety of industries including telecommunications, networking, military, medical electronics and consumer technology.
The mated stack heights of 4.00 to 10.00mm along with a 0.80mm pitch provide design engineers with the ultimate in flexibly to address space constraints without sacrificing performance.
“The marketplace has a great need for a versatile, high density, board-to-board mezzanine solution that provides space savings and high data rates, as well as optimal airflow despite a low stack height,” said Adam Stanczak, new product development manager, Molex. “The Molex SpeedStack connector system not only delivers a low-profile, high-speed solution, it is specifically developed with a narrow housing design to allow better airflow and promote system cooling.”
The SpeedStack Connector System comes in multiple circuit sizes of 22, 44, 60, 82, 104 and 120 with a range of 6 – 32 differential pairs for even greater flexibility. The 100 Ohm design provides superior impedance control with an 85 Ohm version to be released in June 2013 that will support PCIe* Generation (Gen) 3.0 and Intel QuickPath Interconnect (QPI) requirements for next-generation I/O and memory signalling. The insert-moulded wafer design includes a protective shrouded housing, providing support to the terminal location and improved electrical balance. A common ground pin helps improve electrical performance and minimise crosstalk.
