Winbond revealed a new-generation ultra-low-power mobile DRAM solution at electronica conference 2018

Winbond Electronics Corporation presented a new-generation ultra-low-power (ULP) DRAM at the 2018 electronica conference held in Germany last week. The ultra-low-power and high performance of this product make it particularly suitable for wearable and portable devices, or comparable Internet-of-Things applications.

The W948V6KBHX is the first product released by Winbond that carries the latest Deep Self Refresh (DSR) technology. It has a capacity of 256 Mb and is compatible with the LPDDR standards of JEDEC. Compared with the memory of conventional mobile devices, DSR technology decreases standby power consumption by 40 per cent, greatly extending battery life and enhancing end-user experience.

Battery-powered wearable and portable devices are commonly used in daily life. Among such devices, imaging equipment, such as monitoring systems, require memory exceeding the capacity of embedded SRAMs. The W948V6KBHX, which achieves a balance between high performance and low power consumption, has potential to be the optimal DRAM solution for wearable or portable imaging devices.

The excellent performance of W948V6KBHX has been recognised by numerous IC designers. For example, Realtek Semiconductor Corporation has been able to mount it, through the application of system-in-package (SiP) techniques, on the single-chip microcomputer of a RTL8715A Wi-Fi IP Cam system, thereby offering their clients the lowest power consumption among any IC worldwide of the same specifications. Therefore, the W948V6KBHX is the optimal solution for low-power IP camera systems.

Winbond has successfully incorporated DSR technology into numerous products. Always striving for innovation, Winbond will continue to release ultra-low-power mobile memory solutions of various capacities to meet the diverse needs of its clients.

www.winbond.com

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