Features

Microsemi Corporation has announced the availability of its next-generation of 650 volt (V) non-punch through (NPT) insulated bipolar gate transistors (IGBTs), offered in 45A, 70A and 95A current ratings. The new NPT IGBT product family is designed for operation in harsh environments and is particularly well-suited for industrial products such as solar inverters, welders and switch mode power supplies.

Lattice Semiconductor and Future Electronics have signed a global distribution agreement under which Future is authorised to sell Lattice"s complete portfolio of low power, low cost FPGA, CPLD and programmable power management design solutions worldwide.

The USB solutions specialist FTDI Chip has extended its portfolio of semiconductor solutions for USB-to-RS232 interfacing, with the new USB-DUO that bundles the company’s latest high performance USB bridge controller ICs with its RS232 transceiver IC, and which provides engineers with a platform on which they can create their own USB-to-RS232 converter cabling systems - supporting speeds of up to 250 kbits/s.

International Rectifier has introduced the radiation hardened ML Series dual output DC-DC power converter platform designed for RF communication equipment such as low noise amplifiers (LNA), receivers and frequency converters used onboard satellites.

Fujitsu Semiconductor has release the MB51T008A, a silicon substrate-based, gallium-nitride (GaN) power device that features a breakdown voltage of 150 V. Sample quantities of the new product will be made available this month. The new device, which enables normally-off operations, is capable of achieving roughly one half the figure of merit (FOM) of silicon-based power devices with an equivalent breakdown voltage.

Digi-Key Corporation has announced a broadened selection of value added services in response to a growing demand for customisation from its customers. The additional services are intended to help customers accelerate time-to-market and reduce total cost of ownership. The services include: product design, prototyping and production resources and are intended to reduce product design, assembly and development time by tapping into the knowledge and resources of the company’s technical and product distribution teams.

Molex Incorporated has launched a new high-performance connector system that has been designed specifically to enable PCB developers in the video, commercial broadcast and telecommunications industries to transfer multiple RF signals across mated boards in a single assembly while taking into consideration space constraints.

Bridgelux, a developer and manufacturer of LED lighting technologies, has signed a global distribution agreement with Future Electronics, under which the distributor’s lighting division, Future Lighting Solutions, will provide global sales, design support and fulfillment services for Bridgelux’s extensive portfolio of LED products sold through distribution.

HiTek Power’s new OLH10KD family of 10kW high voltage power supply systems has been designed to meet the rigorous requirements associated with ion and electron beam systems, ion implantation and X-ray equipment.

Advanced Power Electronics Corp. (USA), a Taiwanese manufacturer of MOS power semiconductors for DC-DC power conversion applications, has signed a franchise deal with Premier Farnell. Under the terms of the agreement, Premier Farnell will be able to offer Advanced Power"s complete range of power MOSFETs, IGBTs and power ICs worldwide.