QSMP-20 module from Direct Insight utilises DDR3 memory to avoid ongoing AI pressure on lead times and cost
SoM also provides drop-in, pin-compatible upgrade for the QSMP-15
Direct Insight, the UK-based technical systems integrator focused on system-on-module solutions, can now deliver and support development for the new QSMP-20 solder-down QFN-style SoM (system-on-module), providing a drop-in, pin-compatible upgrade for the QSMP-15 that now features an industrial-grade STM32MP2 MPU. The QSMP-20 also takes advantage of lower cost DDR3 RAM with shorter lead times to avoid the ongoing pressure on DDR4 and DDR5 memory supply, driven by demand from AI infrastructure.
“The rapid boom of AI technology is sending shockwaves through the semiconductor memory market,” observes David Pashley, co-founder & Managing Director at Direct Insight. “Skyrocketing demand is ramping up pressure on high performance DDR5 and even DDR4, with prices and lead times spiralling as inventory is bought up and production is shifted to higher-margin high-bandwidth memory. But the QSMP-20 utilises cost-effective, higher availability DDR3L RAM, helping sidestep ongoing AI-driven lead time and supply issues.”
Manufactured by Direct Insight’s long-standing partner, Aachen-based Ka-Ro Electronics, the new QSMP-20 is a system-on-module featuring STMicroelectronics’ STM32MP235 microprocessor – based on the flexible heterogenous architecture of a dual-core ARM Cortex-A35, clocked at 1.2 GHz, and a 400MHz ARM Cortex-M33 coprocessor, combined with a 0.6 TOPS NPU AI accelerator and a 3D GPU.
The module adds 512MB of DDR3L RAM and 4GB eMMC Flash, integrated on a tiny 27mm x 27mm solder-down package, with a height of just 2.6mm. Its QFN-type pinout features a 1mm pitch with 100 edge-located pads, providing unparalleled miniaturisation, thermal efficiency and EMI minimisation. An industrial operating temperature range of -25°C to +85°C is supported and the module requires a single 3.3v supply.
A wide range of I/O interfaces is supported, including CAN-FD, UART, SPI, I2C, audio, Gigabit Ethernet, SD, USB and a MIPI-DSI display interface. Packaged in a compact shielded form factor, the module is ideal for size- and power-sensitive applications, such as smart home devices.
Advanced security and power management features also support IoT and industrial applications, ready for low-power and CRA-compliant system implementations. The QSMP-20 comes with a dedicated development kit, equipped with a Yocto Linux BSP (board support package).
Learn more, download the datasheet, and order modules or development kits at: directinsight.co.uk/system-on-modules/ka-ro-qsmp-20-stm32mp235-solder-down-modules
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