MacDermid Enthone Electronics Solutions (MEES), a global electronics chemicals supplier, will present at the Advances in Thermal Management Conference which will take place at the Hyatt Regency Denver Tech Centre, Denver, CO August 8-9, 2018. The conference gathers organisations in the electronics industry supply chain that depend on the precise dissipation of heat in electronic devices.
The presentation, titled: “Understanding Thermal Demands for PCB Design and Developments in Fabrication”, will be delivered by Rich Bellemare, global applications manager, Metallization, on Thursday, August 9th at 10:00am.
Lenora Clark, director of OEM Applications, who co-authored the paper with Bellemare and Bill Bowerman, director of Metallization, states: “New functional demands in the automotive industry are forcing change in the design and fabrication of PCB’s. These changes affect electrical performance and heat management. This paper explains how a unique electroplating method can increase the PCB’s ability to manage heat and increase the life of the product.”
