CIE Components in Electronics
The company is also offering an evaluation kit that can be used with its SmartFusion customisable system-on-chip solution (cSoC) to enable quicker product-functionality assessments.
“Our new power management solution will help to significantly reduce the cost and complexity of board-level power management design by integrating system management functions required in communications infrastructure applications,” said Esam Elashmawi, vice president and general manager at Microsemi.
Microsemi’s MPM 4.0 power management solution includes a graphical user interface that simplifies the visualization of the power sequencing and margining that occurs in complex high availability systems. In addition, trimming, event logging and alarm generation are supported. The MPM 4.0 also includes a reference design containing all sources files and firmware, allowing customers to customise products and support a mix of power rails.
An evaluation kit to accelerate initial design testing and experimentation is also offered. It includes Microsemi’s SEU-immune SmartFusion cSoC, which is offered in standard or military temperatures in a variety of packages. SmartFusion devices include an integrated FPGA, an ARM Cortex-M3 processor, and programmable analogue in a single device. The kit also includes Microsemi’s NX9415 3.3 V and LX9610 1.5 V nominal regulators.
