Archive

New from electronics packaging specialist Schroff is the TE series thermoelectric cooler, which has been designed to provide a reliable, low-maintenance cooling solution for small electronics enclosures.

Cree has introduced a new four-inch CR4 LED downlight and a higher lumen output six-inch downlight. The new six-inch CR6 downlight uses 87 percent less energy than comparable incandescent lighting and delivers payback in less than one year in many commercial installations.

Chomerics Europe - a division of Parker Hannifin - has introduced a new low closure force EMI gasket that is rated for use in high temperature applications up to 125°C. SOFT-SHIELD 3700 is a fabric over foam (FOF) material that comprises a conductive fabric wrapped around a soft, cellular silicone foam.

Aeroflex Limited has added support for enhanced Inter Cell Interference Cancellation (eICIC) to the TM500 Test Mobile platform, which is already used by all the world’s major infrastructure vendors. Functionality for testing carrier aggregation was added to the platform earlier this year. With this latest update the TM500 LTE-A Test Mobile is being launched, supporting all the key LTE-A features of 3GPP Release 10.

Murata has announced the addition of the DMG series to the company"s line of thin, low-resistance, electrical double-layer capacitors (EDLCs). The DMG supercapacitors are able to provide high power back-up and reliability while offering a five-year life span at 70 degrees C, making them suitable as a  choice for enterprise solid state drive (SSD) manufacturers and telecom "last gasp" applications.

EasySYNC Ltd, a specialist in USB communications and instrumentation systems, has released its CAN-DP serial-to-CANbus converter modules. This new hardware offering enables engineers to quickly and simply add a CANbus port to their PC or embedded system by connection through a serial interconnect.

Lattice Semiconductor has launched version 2.0 of its Lattice Diamond design software for Lattice FPGA products.  Version 2.0 includes advanced support for the new LatticeECP4 FPGA family, that  has helped to redefine the market for low cost, low power, mid-range FPGAs in terms of cost- and power-sensitive wireless, wireline, video and computing applications.

CamdenBoss has extended its range of fuses and fuseholders. The latest addition is suitable for the protection of photovoltaic modules and their conductors in solar power systems. The CF1010g series of solar voltaic power fuses offer current limiting super fast blow and are rated for 1000V operation with 11 types available from 1 to 20A.

Ohmite Manufacturing Company has launched the HVC Series, a range of precision high-value, high-voltage wraparound chip resistors, available in 0805, 1206, and 2512 package sizes.

Vishay Intertechnology has launched a new powdered-iron-based, WPC-compliant (Wireless Power Consortium) receiving coil for the wireless charging of 5 V portable electronics. Offering a durable construction and high permeability shielding, the new IWAS-3827EC-50 provides high efficiency greater than 70 % for Rx applications to 10 W and is 33 % smaller than the standard 48 mm by 32 mm IWAS-4832FF-50 Rx coil, with dimensions of 38 mm by 27 mm.