Bytesnap Design publishes PCB design requirements for consumer, industrial and aerospace applications
ByteSnap Design has released “PCB Design Requirements: Consumer vs Industrial & Aerospace...
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Category: Features
Advantech and FORT Robotics collaborate to advance safe physical AI on MIC-735
Advantech Unveils MIC-735 with NVIDIA Halos AI Systems Inspection Lab Participation and FORT...
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Altus supports Prism Electronics Manufacturing with advanced component management investment
Altus Group, a distributor of capital equipment in the UK and Ireland, has supported Prism...
Read MoreWE United launches inaugural Lead Forward Report
Bringing together key research and data across six areas shaping leadership and progression WE United has announced the launch of its inaugural Lead Forward Report, an analysis consolidating publicly available research and data...
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HUBER+SUHNER and Aurora Networks join forces to help Vodafone Germany develop a next-generation network
HUBER+SUHNER and Aurora Networks, a Vistance Networks business, are collaborating on a...
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Direct Insight: QSMP-20 module utilises DDR3 memory to avoid ongoing AI pressure on lead times and cost
SoM also provides drop-in, pin-compatible upgrade for the QSMP-15 Direct Insight, the UK-based...
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Pickering guide highlights the benefits of reed relays in mining power and signal switching
New application guide explains how high isolation, low leakage and long-term reliability support...
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Fast, compact and lightweight IP67 coolant temperature sensors from Inelco Hunter
Inelco Hunter, a franchised distributor for Amphenol, is pleased to confirm availability of...
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Telonic Instruments launches Siglent SNA5000X-E Series – compact, cost-effective 6.5 GHz vector network analyser for R&D and production
Telonic Instruments, a UK supplier of electronic test and measurement solutions, is pleased to...
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New Panasonic Industry high-precision thick-film resistors enable space and cost-efficient designs
Expanding the Precision Portfolio: Double Power Density with Thin-Film-Level Accuracy (0.1%,...
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Farnell engages engineers with hands-on Edge AI innovation at Embedded World 2026
Farnell EMEA welcomed engineers from across the global electronics industry at Embedded World...
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XSENS MTi-8 Click from MIKROE provides RTK-enhanced GNSS and inertial navigation system (INS) solution
Improve vehicle, drone and field equipment navigation with MTI-8-5A module XSENS MTi-8 Click is a...
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DigiKey launches Engineering Unlocked video series
The new video series explores the future of electronic design DigiKey, the global distributor of...
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Wireless modules for embedded systems now available from Tria Technologies
 Multi-protocol modules support WiFi, Bluetooth and mesh networking standards Tria Technologies,...
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element14 Community launches smart industry design challenge
New challenge invites engineers and makers to bring intelligence to the production line element14,...
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