News

Mid-air haptics experts, Ultrahaptics, has announced the official opening of its first US office in Silicon Valley. The office, which is based in Palo Alto, will house the company’s growing US team. Globally, the team has grown from three to 79 people in the past three years, in part fuelled …

Lattice Semiconductor Corporation, the leading provider of customisable smart connectivity solutions, has announced that Valve has selected Lattice’s low power and low cost iCE40 FPGA to enable concurrent data capture and processing for its SteamVR Tracking. As a low power and low latency sensor hub on the SteamVR tracking platform, …

Edgybees, an augmented reality technology company headquartered in Israel, has been providing augmented reality (AR) software for drones being used by first responders in the Hurricane Harvey relief efforts. Drones are already providing a valuable asset for first responders in speeding up the search for survivors. However, the emergency relief efforts …

E Ink Holdings, “E Ink” (8069.TW), the leading innovator of electronic ink technology, has announced they are renewing their Master Supply Agreement (MSA) with Plastic Logic, designer and manufacturer of flexible, glass-free electrophoretic displays (EPDs). This agreement centres around flexible EPD production and with this partnership, and the continued strength …

Altium has announced a special glimpse at the next generation of leading PCB design software, Altium Designer 18, and more, at the 2017 Engineering Design Show. The annual trade show – the largest of its kind in the United Kingdom – is the UK’s must-attend design event showcasing the latest innovations …

ADLINK Technology, Inc., a leading provider of building blocks and intelligent platforms for edge computing, will be demonstrating its rugged CompactPCI, industrial-grade control system and panel computer product portfolio, specifically designed for on-board ATO/DMI and wayside communication-based train control applications, in three European railway exhibitions: TRAKO in Poland, Expo Ferroviaria …

Telink Semiconductor, developer of highly integrated low power radio-frequency and mixed signal system chips for internet of things (IoT) applications, will be demonstrating a number of applications for smart lighting, smart home, retail and logistics based on its devices at the Bluetooth Asia 2017 conference taking place in Shenzhen, China …

Electronic component specialist Hitaltech is to preview a new prototype enclosure at the Engineering Design Show in October. The BAC-box is designed specifically to fit over the standard UK double-gang back box, offering designers of products for the building automation controls market, an off-the shelf solution for their controls. Lancashire-based Hitaltech will …

Supporting operations and survivability in the field, Raytheon UK’s 10-channel Power Switch Node is fully programmable, compact and lightweight Raytheon UK has unveiled a new 10-channel Power Switch Node (PSN) in response to emerging in-field and operator requirements for military land vehicles. Based on qualified in-service technology selected for the …

HORIBA MIRA – a world leader in defence vehicle design, engineering and testing – has been awarded two contracts for the development of autonomous systems in the Defence and Security Accelerator’s Last Mile competition. The win, which was announced by Defence Minister, Harriett Baldwin, at DSEI on September 14th 2017, …